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ournal Paper

  1. P.H. Wang and T.Y. Wen, "Effects of Electrical Driving Mode on Pressure and Flow Rate of Wire-Rod Electrohydrodynamic Pumps," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, pp. 621-625, 2020

  2. T.Y. Wen and J.L. Su, "Corona Discharge Characteristics of Cylindrical Electrodes in A Two-Stage Electrostatic Precipitator," Heliyon, vol. 6, pp. e03334, 2020

  3. P.F. Hsieh and T.Y. Wen, "Evaluation of Ozone Removal by Spent Coffee Grounds," Scientific Reports, vol. 10, pp. 124-131, 2020

  4. Q.Z. Xue and T.Y. Wen, "Separating Al2O3 Particles from High-Speed Flue Gas by an Induced Flow Recirculation in Two-Stage Electrostatic Precipitator," Separation and Purification Technology, vol. 234, pp. 116105, 2020

  5. P.H. Wang and T.Y. Wen, "Effects of Inlet Blockage and Electrical Driving Mode on Static Pressure and Flow Rate of Wire-Rod Electrohydrodynamic Pumps," Journal of Electrostatics, vol. 103, pp. 103409, 2020

  6. T.Y. Wen and Q.Z. Xue, "Capturing Heavy Loading Microparticles using Electrostatic Precipitator with Square-Wave Collecting Electrode," Powder Technology, vol. 361, pp. 520-528, 2020

  7. T.Y. Wen, K. Lindgren, and A.V. Mamishev, "Electrostatic Fluid Accelerator under High-Speed Free Air Stream," Contributions to Plasma Physics, vol. 56, pp. 951-958, 2016

  8. T.Y. Wen, I. Krichtafovitch, and A.V. Mamishev, "Numerical Study of Electrostatic Precipitators with Novel Particle-Trapping Mechanism," Journal of Aerosol Science, vol. 95, pp. 95-103, 2016

  9. T.Y. Wen, I. Krichtafovitch, and A.V. Mamishev, "The Key Energy Performance of Novel Electrostatic Precipitators," Journal of Building Engineering, vol. 2, pp. 77-84, 2015

  10. T.Y. Wen, H.C. Wang, I. Krichtafovitch and A.V. Mamishev, "Novel Electrodes of an Electrostatic Precipitator for Air Filtration," Journal of Electrostatics, vol. 73, pp. 117-124, 2015

  11. T.Y. Wen, I. Krichtafovitch, and A.V. Mamishev, "Reduction of Aerosol Particulates through the use of an ESP with Guidance-Plate-Covered Collecting Electrodes," Journal of Aerosol Science, vol. 79, pp. 40-47, 2015

onference Paper

  1. Q.Z. Xue and T.Y. Wen, "Evaluating the Effects of Airflow Recirculation on the Collection Efficiency of an Electrostatic Precipitator," Annual Meeting of the Electrostatics Society of America, Rochester, NY, USA, 2019

  2. P.H. Wang and T.Y. Wen, "Experimental Study of Flow Characteristics of Wires-to-Rods Ionic Wind Pumps," Annual Meeting of the Electrostatics Society of America, Boston, MA, USA, 2018 (2nd Place in Student Competition)

  3. J.L. Su and T.Y. Wen, "Nanoparticle Collection using Electrostatic Precipitator with Spike Corona Electrode," Annual Meeting of the Electrostatics Society of America, Ottawa, ON, Canada, 2017

  4. I. Krichtafovitch, T.Y. Wen, and A.V. Mamishev, "Design of an Electronic Air Cleaner with Porous Collecting Electrodes," Annual Meeting of the Electrostatics Society of America, Cocoa Beach, FL, USA, 2013

  5. T.Y. Wen, K. Shen, H.C. Wang, and A.V. Mamishev, "Optimization of Electrostatic Fluid Accelerator," Electronic Components and Technology Conference (ECTC), pp. 240-246, Las Vegas, NV, USA, 2013

  6. T.Y. Wen and S.C. Ku, "Validation of Warpage for Small Form Factor Flip-Chip BGA by Experimental and Numerical Methodology," Electronic Components and Technology Conference (ECTC), pp. 1587-1592, Orlando, FL, USA, 2008

  7. T.Y. Wen and S.C. Ku, "Efficient Evaluation of Substrate Warpage by Finite Element Method and Factorial Design Analysis," Electronic Components and Technology Conference (ECTC), pp. 1754-1759, Reno, NV, USA, 2007

  8. T.Y. Wen and S.C. Ku, "Study for Substrate Warpage by Build-Up Modeling Techniques," ANSYS User Conference, 2006

atent

  1. T.Y. Wen and A.V. Mamishev, "Electrostatic Precipitator," United States Patent US9808808

  2. T.Y. Wen, I.T. Tsai, and Enboa Wu, "Semiconductor Package System and Method of Improving Heat Dissipation of a Semiconductor Package," United States Patent Application, US20080001277 (Pending)

  3. T.Y. Wen, "Chip Package Structure," Taiwan Patent, M348332

  4. Y.Y. Lin and T.Y. Wen, "Multi-Chip Package and Method of Fabricating The Same," United States Patent Application, US20080164620 (Pending); State Intellectual Property Office P.R.C., CN200710003942.5 (Issued)

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